Express 24 LLC

Soldering Flux Manufacturer "Diamond Flux"

PCB Assembly Service

Electronic Manufacturing Consulting

Hallandale, Florida.





Soldering flux Diamond Flux FN231.

Description: Gel in 10g syringe. ROL0 Class, No Clean. Description: Suitable for Soldering of Lead and Lead-Free Alloys. Perfect Wettability of Soldered Surfaces. Low Activity Soldering Flux for Not Highly Oxidized Surfaces, Components and PCBs. Ideal for Repairing and Soldering Electronic Components onto Clean Printed Circuit Boards. For Soldering and Repairing FPGA, BGA, QFN, QFP, SOIC and other Cases of Microcircuits. For Any SMD and DIP Components. Soldering flux for Critical Printed Circuit Boards, Where Neutrality and Passivity of Indelible Flux Residues are Required. Solder Flux Residue not Conducting, not Corrosive. Conforms to Standard J-STD-004B and ROHS. Soldering Flux Residues Can Be Easily Washed Off with PCB Cleaner for Electronic Printed Circuit Boards if Necessary.



Liquid soldering flux Diamond Flux FN232

Description: Liquid in 10g bottle. ROL0 Class, No Clean. Liquid Soldering Flux for Soldering Electronics and Printed Circuit Boards. The Brush is Built into the Cap for Convenient Application of Soldering Flux. Soldering Flux Residues after Soldering Do Not Cause Corrosion of the Printed Circuit Board and Components. Soldering Flux Residues after Soldering Do Not Cause Current Leakage. Residues of Soldering Flux Do Not Require Mandatory Cleaning after Soldering and Remain Neutral and Passive. Liquid Soldering Flux FN232 Can Be cleaned with Cleaning Agents and Sprays for Cleaning Printed Circuit Boards. Conforms to Standard J-STD-004B and ROHS.